首页> 外国专利> Plasma doping device, plasma doping method, production method, and semiconductor device of semiconductor device

Plasma doping device, plasma doping method, production method, and semiconductor device of semiconductor device

机译:等离子体掺杂装置,等离子体掺杂方法,制造方法以及半导体装置的半导体装置

摘要

Topic At the time of doping, as the damage for the suffering processing baseplate is decreased, the plasma doping device which can process uniformly is offered.SolutionsPlasma doping device 31, the processing container inside 32 which inside that makes the dopant the suffering processing baseplate fill and processing container 32 the doping gas and gas supply section is arranged inside 33 which supplies the inert gas for plasma excitation and processing container 32, bias electric power supply possible high frequency power source has with the control section 28 which controls 58 and plasma doping device 31 in the plasma generator 39 which generates the plasma inside processing container 32 of the support stand making use 34 which supports suffering processing baseplate W on that and microwave, and support stand 34. Here, control section 28, in order for ion energy of the dopant to be under 100eV, controls the bias electric power which is supplied with high frequency power source 58. Selective figure Figure 2
机译:<主题>在掺杂时,由于减少了对被处理基板的损伤,提供了能够均匀处理的等离子体掺杂装置。解决方案等离子掺杂装置31,内部的处理容器32使被掺杂物在内部进行处理。基板填充处理容器32的内部设置有掺杂气体和气体供给部33,该等离子体气体供给用于等离子体激发的惰性气体并处理容器32,可能的高频电源通过控制部28来控制电源58和等离子体的偏置电源。等离子体产生器39中的掺杂装置31和支撑架34,其中等离子体产生器39在内部产生等离子体的等离子体发生器39中的掺杂装置31和支撑架34支撑在支撑架34的处理容器32的内部,该支撑架34支撑受处理基板W和微波。当掺杂剂的掺杂功率低于100eV时,控制由高频电源58提供的偏置电功率。 <选择图>图2

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号