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PLASMA ETCHING DEVICE AND PLASMA CLEANING METHOD

机译:等离子刻蚀装置及等离子清洗方法

摘要

PROBLEM TO BE SOLVED: To provide a plasma etching device capable of suppressing accumulation of etching products containing a noble metal element in a vacuum chamber, and a plasma cleaning method.;SOLUTION: A plasma etching device 10 comprises: a vacuum chamber C in which to house a substrate S; an etching gas supply unit 17a which supplies an etching gas to the vacuum chamber C; a cleaning gas supply unit which supplies a cleaning gas to the vacuum chamber C; and a plasma generation unit which generates a plasma in the vacuum chamber C with the gas in the vacuum chamber C. This etching device etches the substrate S with a plasma of the etching gas and cleans etching products in the vacuum chamber C with a plasma of the cleaning gas. The object to be etched includes at least one of iridium and platinum. The cleaning gas is a mixed gas of a sulfur hexafluoride gas and an oxygen gas.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种等离子体蚀刻装置,其能够抑制包含贵金属元素的蚀刻产物在真空室中的积聚;以及等离子体清洁方法。解决方案:等离子体蚀刻装置10包括:真空室C,其中容纳基板S;蚀刻气体供给部17a,其向真空室C供给蚀刻气体。清洁气体供应单元,其向真空室C供应清洁气体;该蚀刻装置利用蚀刻气体的等离子体对基板S进行蚀刻,并利用等离子体处理装置对在真空室C内的蚀刻产物进行清洗。清洁气体。待蚀刻的物体包括铱和铂中的至少一种。清洁气体是六氟化硫气体和氧气的混合气体。;版权所有:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013030696A

    专利类型

  • 公开/公告日2013-02-07

    原文格式PDF

  • 申请/专利权人 ULVAC JAPAN LTD;

    申请/专利号JP20110167349

  • 发明设计人 KOKAZE YUTAKA;

    申请日2011-07-29

  • 分类号H01L21/3065;H01L21/28;

  • 国家 JP

  • 入库时间 2022-08-21 16:58:11

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