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Surface reforming manner of orientation substrate for epitaxial film formation and orientation substrate for epitaxial film formation

机译:外延膜形成用取向基板和外延膜形成用取向基板的表面改性方式

摘要

Orientation degree and smoothness of a substrate surface better than those of conventional ones are provided in a textured substrate for epitaxial thin film growth. The present invention is a textured substrate for epitaxial film formation, including a crystal orientation improving layer made of a metal thin film of 1 to 5000 nm in thickness ON the surface of the textured substrate for epitaxial film formation having a textured metal layer at least ON one surface and wherein differences between orientation degrees ( and ) in the textured metal layer surface and orientation degrees ( and ) in the crystal orientation improving layer surface are both 0.1 to 3.0. Further, when another metal different from the metal constituting this textured substrate crystal orientation improving layer is added equivalent to a thin film which is 30 nm or less, and subsequently is subjected to HEAT treatment and the smoothness of that surface can be improved. At this time and the surface roughness of the substrate surface becomes 20 nm or less.
机译:在用于外延薄膜生长的纹理化衬底中提供了比传统衬底更好的衬底表面的取向度和光滑度。本发明是一种外延膜形成用纹理衬底,其特征在于,在外延膜形成用纹理衬底的表面具有至少1μm以上的金属外延膜的表面上具有由厚度为1〜5000nm的金属薄膜构成的晶体取向改善层。在一种表面上,其中在纹理化的金属层表面中的取向度(和)与在晶体取向改善层表面中的取向度(和)之间的差均为0.1至3.0。此外,当与构成该纹理化衬底晶体取向改善层的金属不同的另一种金属等效地添加到30nm或更小的薄膜中,然后进行HEAT处理,可以改善该表面的光滑度。此时,基板表面的表面粗糙度为20nm以下。

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