Being production manner of the clad orientation metal substrate for the epitaxial thin film formation which

摘要

PROBLEM TO BE SOLVED: To provide an orientation substrate for epitaxial thin film formation that has higher orientation and higher strength than those of conventional ones, and its manufacturing method.;SOLUTION: This is a cladding orientation metal substrate for the epitaxial thin film formation composed of a metal layer and a nickel layer bonded to at least one face of the metal layer, in which the nickel layer has a {100} (001) cubic texture with a crystal axis drift angle Δϕ of Δϕ≤7°, while the nickel layer has a nickel purity of 99.9% or more. This orientation metal substrate is manufactured by bonding the metal plate and the orientation treated nickel plate by surface activation bonding after the nickel plate with the purity of 99.9% or more is cold-worked, heat-treated, and orientation heat-treated.;COPYRIGHT: (C)2009,JPO&INPIT