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Being production manner of the clad orientation metal substrate for the epitaxial thin film formation which
Being production manner of the clad orientation metal substrate for the epitaxial thin film formation which
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机译:作为外延薄膜形成用包层取向金属基板的制造方式,
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摘要
PROBLEM TO BE SOLVED: To provide an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and high strength, and to provide a method for manufacturing the same.;SOLUTION: The clad textured metal substrate for forming the epitaxial thin film thereon comprises a metal layer and a copper layer which is bonded to at least one face of the metallic layer. The copper layer has a {100}001 cube texture in which a deviating angle Δϕ of crystal axes satisfies Δϕ≤6°. The oriented metal substrate is provided with an intermediate layer for the epitaxial thin film formed on the surface of the copper layer, and the intermediate layer preferably has at least one layer among the layers consisting of nickel, nickel oxide, zirconium oxide, rare earth oxide, magnesium oxide, strontium titanate (STO), strontium titanate-barium (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium, and platinum.;COPYRIGHT: (C)2009,JPO&INPIT
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