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Being production manner of the clad orientation metal substrate for the epitaxial thin film formation which

机译:作为外延薄膜形成用包层取向金属基板的制造方式,

摘要

PROBLEM TO BE SOLVED: To provide an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and high strength, and to provide a method for manufacturing the same.;SOLUTION: The clad textured metal substrate for forming the epitaxial thin film thereon comprises a metal layer and a copper layer which is bonded to at least one face of the metallic layer. The copper layer has a {100}001 cube texture in which a deviating angle Δϕ of crystal axes satisfies Δϕ≤6°. The oriented metal substrate is provided with an intermediate layer for the epitaxial thin film formed on the surface of the copper layer, and the intermediate layer preferably has at least one layer among the layers consisting of nickel, nickel oxide, zirconium oxide, rare earth oxide, magnesium oxide, strontium titanate (STO), strontium titanate-barium (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium, and platinum.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种取向衬底,用于在其上形成外延薄膜,该衬底具有比常规衬底更好的取向并且具有高强度,并提供一种制造该衬底的方法。用于在其上形成外延薄膜的金属衬底包括金属层和结合到金属层的至少一个面上的铜层。铜层具有{100} <001>立方体纹理,其中偏角Δφ为0。晶轴的轴满足Δ6。取向金属基板在铜层的表面上形成有用于形成外延薄膜的中间层,该中间层优选具有由镍,氧化镍,氧化锆,稀土氧化物构成的层中的至少一层。 ,氧化镁,钛酸锶(STO),钛酸锶钡(SBTO),氮化钛,银,钯,金,铱,钌,铑和铂。;版权:(C)2009,JPO&INPIT

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