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The orientation substrate and its production manner null for epitaxial film formation
The orientation substrate and its production manner null for epitaxial film formation
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机译:取向基板及其生产方式对外延膜形成无效
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摘要
PROBLEM TO BE SOLVED: To provide an orientation substrate for epitaxial thin film growth having a good orientation and capable of forming a high quality epitaxial film.;SOLUTION: In the orientation substrate for epitaxial film formation having an oriented metal layer at least on one side, the oriented metal layer consists of a copper layer having a cube texture, and a nickel layer of 100-20000 nm thick formed thereon. The nickel layer has a nickel oxide layer of 1-30 nm thick formed on the surface thereof, and has a palladium-containing region consisting of nickel containing palladium on the boundary surface to the nickel oxide layer. The uppermost layer, i.e., the nickel oxide layer, of the orientation substrate has a surface roughness of 10 nm or less, preferably.;COPYRIGHT: (C)2013,JPO&INPIT
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