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The orientation substrate and its production manner null for epitaxial film formation

机译:取向基板及其生产方式对外延膜形成无效

摘要

PROBLEM TO BE SOLVED: To provide an orientation substrate for epitaxial thin film growth having a good orientation and capable of forming a high quality epitaxial film.;SOLUTION: In the orientation substrate for epitaxial film formation having an oriented metal layer at least on one side, the oriented metal layer consists of a copper layer having a cube texture, and a nickel layer of 100-20000 nm thick formed thereon. The nickel layer has a nickel oxide layer of 1-30 nm thick formed on the surface thereof, and has a palladium-containing region consisting of nickel containing palladium on the boundary surface to the nickel oxide layer. The uppermost layer, i.e., the nickel oxide layer, of the orientation substrate has a surface roughness of 10 nm or less, preferably.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供用于外延薄膜生长的取向衬底,该取向衬底具有良好的取向并且能够形成高质量的外延膜。解决方案:在用于外延膜形成的取向衬底中,至少在一侧上具有取向的金属层。取向金属层由具有立方体纹理的铜层和在其上形成的100-20000nm厚的镍层组成。镍层在其表面上形成有1-30nm厚的氧化镍层,并且在与氧化镍层的界面上具有由含镍钯构成的含钯区域。定向基板的最上层,即氧化镍层的表面粗糙度最好为10 nm或更小; COPYRIGHT:(C)2013,JPO&INPIT

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