CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDER BUMP CONTACTS

摘要

A method forms an integrated circuit structure, using a manufacturing device, to have kerf regions and external contacts, and to have conductive structures in the kerf regions. The method also forms an underfill material on a surface of the integrated circuit structure, using the manufacturing device, that contacts the kerf regions and the external contacts. The underfill material comprises electrically attracted filler particles that affect the coefficient of thermal expansion and elastic modulus of the underfill material. When forming the underfill material, the method applies an electrical charge to the conductive structures and the external contacts.