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Package for vacuum encapsulation of an associated microelectromechanical system, and a method for detecting a problem with a solder joint in such an assembly
Package for vacuum encapsulation of an associated microelectromechanical system, and a method for detecting a problem with a solder joint in such an assembly
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机译:用于真空封装相关微机电系统的封装,以及用于检测这种组件中的焊点问题的方法
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摘要
Package (BT) for vacuum encapsulation of a microelectromechanical system (MEMS) provided with an electrically conductive element intended to be soldered to said package (BT), said package (BT) comprising a metallized base (FM), designed to be soldered to said microelectromechanical system (MEMS), and output electrical contacts (CES), electrically connected to electrical-contact elements of said microelectromechanical system. Said metallized base (FM) comprises a plurality of metallized surface portions (PSM), respectively bounded by an unmetallized solder stop region, and respectively connected to the rest of the metallized base (FM) by a metallized track (PTEM), having a small width relative to the corresponding width of said portion (PSM), said metallized surface portions (PSM) being designed to be soldered to said microelectromechanical system (MEMS).
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