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Uncertainty in Manufacture and Assembly of Multiple-Joint Solder Self- Assembled Microelectromechanical Systems (MEMS).

机译：多关节焊料自组装微机电系统（mEms）制造和组装的不确定性。

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Surface-micromachined microelectromechanical systems (MEMS) are two dimensional in their 'as fabricated' form. Surface-micromachined MEMS can be assembled after fabrication to realize systems with a more three-dimensional form and function. One reliable m ...

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作者
J. P. Kharoufeh P. E. Kladitis V. M. Bright;
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年度 2004
页码 1-20
总页数 20
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Assembly; Fabrication; Manufacturing; Mems(Microelectromechanical systems); Microelectromechanical systems; Solder self-assemblies; Soldering; Surface micromachining; Tolerance; Tolerance analysis; Uncertainty;

机译：装配;制造;制造; mems（微机电系统）;微机电系统;焊料自组装;焊接;表面微加工;公差;公差分析;不确定度;
入库时间 2022-08-29 11:02:42

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专利

1. Uncertainty in Manufacture and Assembly of Multiple-Joint Solder Self-Assembled Microelectromechanical Systems (MEMS) [J] . Paul E. Kladitis, Victor M. Bright, Jeffrey P. Kharoufeh Journal of Manufacturing Processes . 2004,第1期

机译：多接头焊料自组装微机电系统（MEMS）的制造和组装不确定性
2. Eutectic Solder Bonding for Highly Manufacturable Microelectromechanical Systems Probe Card [J] . Bonghwan Kim Japanese journal of applied physics . 2011,第6Issue2期

机译：高可制造微机电系统探针卡的共晶焊料键合
3. Additive manufacturing of three-dimensional (3D) microfluidic-based microelectromechanical systems (MEMS) for acoustofluidic applications [J] . Cesewski Ellen, Haring Alexander P., Tong Yuxin, Lab on a chip . 2018,第14期

机译：用于声学应用的三维（3D）微流体基微电子机械系统（MEMS）的添加剂制造
4. Solder bonding for microelectromechanical systems (MEMS) applications [C] . Abhijat Goyal, Srinivas Tadigadapa, Rafiqul Islam Conference on Reliability, Testing, and Characterization of MEMS/MOEMS II, Jan 27-29, 2003, San Jose, California, USA . 2003

机译：用于微机电系统（MEMS）应用的焊接
5. Issues in the design, modeling, and manufacture of multiple joint solder self-assembled micro-electro-mechanical systems (MEMS). [D] . Kladitis, Paul Emmanuel. 2001

机译：多接头焊料自组装微机电系统（MEMS）的设计，建模和制造中的问题。
6. Additive Manufacturing of Three-dimensional (3D) Microfluidic-based Microelectromechanical Systems (MEMS) for Acoustofluidic Applications [O] . Ellen Cesewski, Alexander P. Haring, Yuxin Tong, -1

机译：用于声流体应用的基于三维（3D）微流体的微机电系统（MEMS）的增材制造
7. Modeling for solder self-assembled MEMS [O] . Harsh And Lee, K. Harsh, Y. C. Lee 1998

机译：焊料自组装mEms的建模

Uncertainty in Manufacture and Assembly of Multiple-Joint Solder Self- Assembled Microelectromechanical Systems (MEMS).

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