Housing for vacuum encapsulation of an electromechanical microsystem, associated assembly and method for detecting a solder problem in such an assembly

摘要

The housing (BT) has a metallic bottom part connected to a microelectro-mechanical system assembly, and output electrical contacts (CES) electrically connected to electrical contact elements of the system. The bottom part comprises metallized surface portions (PSM) that are defined by a non-metallic solder stop zone and connected to a rest of the bottom part by a metallic track (PTEM) having width smaller than width of the corresponding surface portion. The surface portions are soldered to the system. An independent claim is also included for a method for detecting soldering problem in a microelectro-mechanical system assembly.