ELECTROMECHANICAL MICROSYSTEM VACUUM ENCAPSULATION BOX, ASSOCIATED ASSEMBLY, AND METHOD OF DETECTING A SOLDER PROBLEM IN SUCH A KIT.

摘要

Housing (BT) able to encapsulate under vacuum an electromechanical microsystem (MEMS) provided with an electrical conductive element intended to be soldered with said housing (BT), said housing (BT) comprising a metallized bottom (FM), adapted to be bonded electromechanical microsystem (MEMS) brazing, and electrical output contacts (CES) electrically connected to electrical contact elements of said electromechanical microsystem. Said metallized bottom (FM) comprises a plurality of metallized surface portions (PSM), delimited respectively by a non-metallized brazing stop zone and respectively connected to the rest of the metallised bottom (FM) by a metallized track (PTEM) of small width relative to the width of said corresponding portion (PSM), intended to be brazed with said electromechanical microsystem (MEMS).