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Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device
Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device
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机译:半导体器件中多孔和无孔镍层以及金层的化学镀
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摘要
A method for maintaining non-porous nickel layer at a nickel/passivation interface of a semiconductor device in a nickel/gold electroless plating process. The method can include sequentially electroless plating of each of the nickel layer and gold layer on the device layer to pre-determined thicknesses to prevent corrosion of the nickel layer from reaching the device layer during the electroless gold plating process.
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