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INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES
INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES
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机译:集成翻译的土地网格阵列和半导电设备的加载机制
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摘要
A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
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