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Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices
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机译:半导体器件的集成式平移栅格阵列插座和加载机制
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摘要
A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
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