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Radiation Hardness Assurance Testing of Microelectronic Devices and Integrated Circuits: Radiation Environments, Physical Mechanisms, and Foundation for Hardness Assurance.

机译:微电子器件和集成电路的辐射硬度保证测试:辐射环境,物理机制和硬度保证基础。

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摘要

This document describes the radiation environments, physical mechanisms, and test philosophies that underpin the radiation hardness assurance test methodologies presented in Parts A and B. The natural space radiation environment is presented, including the contributions of both trapped and transient particles. The effects of shielding on radiation environments are briefly discussed. Laboratory radiation sources used to simulate radiation environments are covered, including how to choose appropriate sources to mimic environments of interest. The fundamental interactions of radiation with materials via direct and indirect ionization are summarized. Some general test considerations are covered, followed by in-depth discussions of physical mechanisms and issues for total dose and single-event effects testing. The purpose of this document is to describe why the test protocols we use are constructed the way they are. In other words, to answer the question: Why do we test it that way.

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