首页> 外国专利> METHOD FOR FORMING A POLYSILICON RESISTOR IN A REPLACEMENT METAL GATE PROCESS AND A SEMICONDUCTOR DEVICE INCLUDING THE POLYSILICON RESISTOR CAPABLE OF REPLACING A POLYSILICON GATE WITH A METAL GATE

METHOD FOR FORMING A POLYSILICON RESISTOR IN A REPLACEMENT METAL GATE PROCESS AND A SEMICONDUCTOR DEVICE INCLUDING THE POLYSILICON RESISTOR CAPABLE OF REPLACING A POLYSILICON GATE WITH A METAL GATE

机译:在替换金属门工艺中形成多晶硅电阻器的方法以及包括能够用金属门代替多晶硅栅的多晶硅电阻器的半导体器件

摘要

PURPOSE: A method for forming a polysilicon resistor in a replacement metal gate process and a semiconductor device including the same are provided to prevent a resistance structure from being removed in removing a polysilicon layer by forming a photoresist on a substrate including the resistance structure before the polysilicon is removed.;CONSTITUTION: A substrate(100) includes an STI(Shallow Trench Isolation) region(110). A first SG FET(120), a second SG FET(130), and a resistance structure(140) are formed on the substrate. A polysilicon layer(152) is formed on a gate oxide layer(150). A sidewall spacer(154,156) is formed on both sides of the polysilicon layer. A photoresist(172) is formed on the substrate region including the resistance structure.;COPYRIGHT KIPO 2013
机译:目的:提供一种在替代金属栅极工艺中形成多晶硅电阻器的方法以及包括该方法的半导体器件,以通过在包括电阻结构的基板上形成光致抗蚀剂来防止在去除多晶硅层时去除电阻结构。构成:衬底(100)包括STI(浅沟槽隔离)区域(110)。在基板上形成第一SG FET(120),第二SG FET(130)和电阻结构(140)。在栅极氧化物层(150)上形成多晶硅层(152)。在多晶硅层的两侧上形成侧壁隔离物(154,156)。在包括电阻结构的衬底区域上形成光刻胶(172)。; COPYRIGHT KIPO 2013

著录项

  • 公开/公告号KR20130009571A

    专利类型

  • 公开/公告日2013-01-23

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20110146147

  • 发明设计人 KIM JE DON;KIM JU YOUN;

    申请日2011-12-29

  • 分类号H01L21/336;H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:49

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