首页> 外国专利> METHOD FOR MANUFACTURING A REPLACEMENT SOURCE/DRAIN FINFET CAPABLE OF REDUCING A SOURCE AND A DRAIN RESISTANCE

METHOD FOR MANUFACTURING A REPLACEMENT SOURCE/DRAIN FINFET CAPABLE OF REDUCING A SOURCE AND A DRAIN RESISTANCE

机译:能够减少源极和漏极电阻的替换源极/漏极finFET的制造方法

摘要

PURPOSE: A method for manufacturing a replacement source/drain FINFET is provided to increase the mobility of electrons and holes in a channel by transforming semiconductor in the channel.;CONSTITUTION: A FINFET with a pin including a source, a drain region and a channel region is formed. The pin is etched on a semiconductor wafer(302). An insulating layer touches the channel region(304). A gate stack is made of a conductive gate material and touches the insulating layer(304). The source and the drain regions are etched to expose the first region of the pin(306). A part of the first region is doped(1602).;COPYRIGHT KIPO 2013;[Reference numerals] (1602) Doping the exposed area of the pin structure; (1604) Growing silicon on the sides of a channel in the source and drain areas; (302) Etching a pin structure having a source area, a drain area, and a channel area; (304) Forming a gate; (306) Etching and removing the source and drain areas of the pin structure
机译:目的:提供一种用于制造替代源极/漏极FINFET的方法,以通过转换沟道中的半导体来增加沟道中电子和空穴的迁移率;组成:具有引脚的FINFET,其引脚包括源极,漏极区域和沟道区域形成。该销被蚀刻在半导体晶片上(302)。绝缘层接触沟道区(304)。栅极叠层由导电栅极材料制成并且接触绝缘层(304)。蚀刻源极和漏极区域以暴露出引脚(306)的第一区域。掺杂第一区域的一部分(1602)。COPYRIGHT KIPO 2013; [附图标记](1602)掺杂销结构的暴露区域。 (1604)在源极和漏极区域中的沟道的侧面上生长硅; (302)刻蚀具有源极区,漏极区和沟道区的引脚结构; (304)形成一扇门; (306)蚀刻和去除引脚结构的源极和漏极区域

著录项

  • 公开/公告号KR20130014041A

    专利类型

  • 公开/公告日2013-02-06

    原文格式PDF

  • 申请/专利权人 ADVANCED ION BEAM TECHNOLOGY INC.;

    申请/专利号KR20120082804

  • 发明设计人 YEN TZU SHIH;TANG DANIEL;

    申请日2012-07-27

  • 分类号H01L21/336;H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:45

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