首页> 外国专利> SEMICONDUCTOR DEVICE WITH A STRAINED CHANNEL INDUCED BY A HIGH-K CAPPING METAL LAYER CAPABLE OF IMPROVING THE MOBILITY OF ELECTRONS

SEMICONDUCTOR DEVICE WITH A STRAINED CHANNEL INDUCED BY A HIGH-K CAPPING METAL LAYER CAPABLE OF IMPROVING THE MOBILITY OF ELECTRONS

机译:高K覆盖金属层诱发应变通道的半导体装置,可改善电子的流动性

摘要

PURPOSE: A semiconductor device with a strained channel induced by a high-K capping metal layer is provided to improve the performance of a device by using a metal gate transistor.;CONSTITUTION: A semiconductor substrate is provided(102). A HK(High-K) dielectric layer is deposited on the semiconductor substrate(104). A tensile stress HK capping layer is deposited on the HK dielectric layer(106). The tensile stress HK capping layer is removed from an NMOS region(108). A compressive stress capping layer is deposited on the NMOS region(110).;COPYRIGHT KIPO 2013;[Reference numerals] (102) Providing a substrate; (104) Depositing an HK layer; (106) Depositing a tensile stress HK capping layer; (108) Removing the tensile stress HK capping layer from an NMOS; (110) Depositing a compressive stress capping layer on the NMOS; (112) Charging metal;
机译:目的:提供一种具有由高K覆盖金属层引起的应变沟道的半导体器件,以通过使用金属栅极晶体管来提高器件的性能。;组成:提供一种半导体衬底(102)。在半导体衬底(104)上沉积HK(高K)介电层。在HK介电层(106)上沉积拉伸应力HK覆盖层。从NMOS区域(108)去除拉伸应力HK覆盖层。压缩应力覆盖层沉积在NMOS区域(110)上; COPYRIGHT KIPO 2013; [102]提供衬底; (104)沉积香港层; (106)沉积拉伸应力HK盖层; (108)从NMOS去除拉伸应力HK覆盖层; (110)在NMOS上沉积压应力覆盖层; (112)充电金属;

著录项

  • 公开/公告号KR20130032230A

    专利类型

  • 公开/公告日2013-04-01

    原文格式PDF

  • 申请/专利权人 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.;

    申请/专利号KR20120010395

  • 发明设计人 XU JEFF J.;

    申请日2012-02-01

  • 分类号H01L29/78;H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 16:27:26

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