首页> 外文期刊>Applied Physics Letters >Electron-electron scattering-induced channel hot electron injection in nanoscale n-channel metal-oxide-semiconductor field-effect-transistors with high-k/metal gate stacks
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Electron-electron scattering-induced channel hot electron injection in nanoscale n-channel metal-oxide-semiconductor field-effect-transistors with high-k/metal gate stacks

机译:具有高k /金属栅叠层的纳米级n沟道金属氧化物半导体场效应晶体管中的电子电子散射诱导沟道热电子注入

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This work investigates electron-electron scattering (EES)-induced channel hot electron (CHE) injection in nanoscale n-channel metal-oxide-semiconductor field-effect-transistors (n-MOSFETs) with high-k/metal gate stacks. Many groups have proposed new models (i.e., single-particle and multiple-particle process) to well explain the hot carrier degradation in nanoscale devices and all mechanisms focused on Si-H bond dissociation at the Si/SiO2 interface. However, for high-k dielectric devices, experiment results show that the channel hot carrier trapping in the pre-existing high-k bulk defects is the main degradation mechanism. Therefore, we propose a model of EES-induced CHE injection to illustrate the trapping-dominant mechanism in nanoscale n-MOSFETs with high-k/metal gate stacks.
机译:这项工作研究了具有高k /金属栅叠层的纳米级n沟道金属氧化物半导体场效应晶体管(n-MOSFET)中电子电子散射(EES)诱导的沟道热电子(CHE)注入。许多小组提出了新的模型(即单颗粒和多颗粒过程)来很好地解释纳米级器件中的热载流子降解以及所有机制都集中在Si / SiO 2 界面。然而,对于高k介电器件,实验结果表明,沟道热载流子在先前存在的高k体缺陷中的捕获是主要的降解机理。因此,我们提出了一种由EES诱导的CHE注入的模型,以说明具有高k /金属栅叠层的纳米级n-MOSFET的俘获主导机理。

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