DIE PACKAGE CAPABLE OF REDUCING THE OVERHEAD OF A DIE SIZE AND A SYSTEM HAVING THE SAME

摘要

PURPOSE: A die package and a system having the same are provided to reduce the process load of the die package by connecting dies to both sides of an interposer.;CONSTITUTION: A first die (250) is mounted on an interposer (230). The first die includes a vertical electrical connection unit (251). A second die (260) connects a package substrate and the interposer. The second die includes a vertical connection unit (261). A third die (270) and a fourth die (280) are laminated on the first die and the second die respectively.;COPYRIGHT KIPO 2013