METHOD FOR LAMINATING A DIE, CAPABLE OF REDUCING THE SIZE OF A SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for laminating a die is provided to form the multiple structure of a flip chip package by continuously laminating a flip chip die of a single structure.;CONSTITUTION: A first flip chip die (10) with a column (14) is formed. The column is electrically connected to the edge of the first flip chip die. The surface of the column of the first flip chip die is exposed. A second flip chip die (18) is laminated on the first flip chip die. The second flip chip die is electrically connected to the column of the first flip chip die.;COPYRIGHT KIPO 2013