STACK TYPE PACKAGE HAVING NOISE SHIELDING FILM CAPABLE OF REDUCING NOISE ABOUT CROSS-TALK BETWEEN UPPER DIE AND LOWER DIE

摘要

PURPOSE: A stack type package having a noise shielding film is provided to improve stability of operating property of a device with a semiconductor package using high frequency by reducing cross-talk between laminated semiconductor dies.;CONSTITUTION: A substrate(110) forms wiring. A lower die(120) is laminated on the substrate and electrically connects the wiring. An upper die(130) is formed on an upper layer of the lower dye and connected to the substrate with a conductive material. A noised shielding film(150a,150b) is formed between the lower die and the upper die.;COPYRIGHT KIPO 2010