CARRIER DEVICE FOR A SEMICONDUCTOR CHIP WITH A SOLDER BARRIER AGAINST SOLDER CREEP, ELECTRONIC COMPONENT AND OPTOELECTRONIC COMPONENT PROVIDED THEREWITH

摘要

It discloses a carrier device for a semiconductor chip (3), that the carrier device comprises an assembly section 21 and the soldering area 20, bondable and / or solderable metal carrier (1) having the semiconductor chip (3) but, the carrier (1) is at least partially covered with a cover material (2), the solder region 20 and the assembly zone 21 soldered to the boundary surface 10 between the carrier 1 and the cover material (2), the barrier between the 4 is disposed. Further, it discloses an electronic device and a photoelectric element. ;