Soldering pads of variable thickness in optoelectronic semiconductor chip, on a connection carrier for mounting a semiconductor chip, method for producing an optoelectronic component and optoelectronic component with these solder pads

摘要

An optoelectronic semiconductor chip (1) has a rear side (12) with a centre (12S) and two contact points (13) spaced apart from each other for making electrical contact with the semiconductor chip (1). There are two solder pads (3) on the contact points (13), the centre (12S) lying in the region between the contact points (13), and the solder pads (3) protruding from the rear side (12) and being exposed. The solder pads (3) are on average deliberately thicker away from the centre (12S) than in the vicinity of the centre (12S) or vice versa.