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SOLDER PADS OF VARIABLE THICKNESS IN AN OPTOELECTRONIC SEMICONDUCTOR CHIP, ON A CONNECTION SUBSTRATE FOR MOUNTING A SEMICONDUCTOR CHIP, METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT HAVING SAID SOLDER PADS
SOLDER PADS OF VARIABLE THICKNESS IN AN OPTOELECTRONIC SEMICONDUCTOR CHIP, ON A CONNECTION SUBSTRATE FOR MOUNTING A SEMICONDUCTOR CHIP, METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT HAVING SAID SOLDER PADS
An optoelectronic semiconductor chip (1) has a rear side (12) with a centre (12S) and two contact points (13) spaced apart from each other for making electrical contact with the semiconductor chip (1). There are two solder pads (3) on the contact points (13), the centre (12S) lying in the region between the contact points (13), and the solder pads (3) protruding from the rear side (12) and being exposed. The solder pads (3) are on average deliberately thicker away from the centre (12S) than in the vicinity of the centre (12S) or vice versa.
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