SnAgCu-BASED SOLDER POWDER AND PASTE FOR SOLDER USING THIS POWDER

摘要

PROBLEM TO BE SOLVED: To provide fine solder powder which is suitable for a paste for solder capable of achieving a fine pitch, and which is excellent in fusibility and wettability during reflow.;SOLUTION: Provided is SnAgCu-based solder powder having an average particle size of 5 μm or less, wherein a dried material of a solution of hydroxybenzoic acid having a melting point of 250°C or lower or its ester is adhered to the solder powder surface as an additive.;COPYRIGHT: (C)2014,JPO&INPIT