SnAgCu-BASED SOLDER POWDER AND PASTE FOR SOLDER USING THIS POWDER

摘要

PROBLEM TO BE SOLVED: To provide SnAgCu-based solder powder excellent in fusibility and wettability during reflow, which is fine solder powder suitable for paste for solder capable of achieving a fine pitch, and to provide a paste for solder using this powder.;SOLUTION: To provide SnAgCu-based solder powder having an average particle size of 5 μm or less, wherein a dried material of a solution of oxalic acid is adhered to the solder powder surface as an additive.;COPYRIGHT: (C)2014,JPO&INPIT