首页> 外国专利> SPUTTERING TARGET FOR FORMING Ag ALLOY FILM, Ag ALLOY FILM, Ag ALLOY REFLECTION FILM, Ag ALLOY CONDUCTIVE FILM, AND Ag ALLOY SEMITRANSPARENT FILM

SPUTTERING TARGET FOR FORMING Ag ALLOY FILM, Ag ALLOY FILM, Ag ALLOY REFLECTION FILM, Ag ALLOY CONDUCTIVE FILM, AND Ag ALLOY SEMITRANSPARENT FILM

机译:形成Ag合金膜,Ag合金膜,Ag合金反射膜,Ag合金导电膜和Ag合金半透明膜的溅射靶材

摘要

PROBLEM TO BE SOLVED: To provide a sputtering target for allowing forming an Ag alloy film which has excellent optical properties such as reflectivity or transmittance, has a low specific resistance, and is superior in various resistant properties such as heat resistance and environmental resistance, of which reflectivity does not change much even after heat treatment, and of which optical properties such as reflectivity or transmittance and the specific resistance do not change much under a use environment.;SOLUTION: A sputtering target for forming an Ag alloy film according to the invention has a composition of 0.2 atomic% or more and 2.0 atomic% or less of Sb, and 0.05 atomic% or more and 1.00 atomic% or less of Mg, with the balance being Ag and inevitable impurities.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种用于形成Ag合金膜的溅射靶,该Ag合金膜具有优异的光学性能,例如反射率或透射率,具有低的电阻率,并且在各种耐热性例如耐热性和耐环境性方面优异。其反射率甚至在热处理后也不会改变很多,并且其光学性能例如反射率或透射率和电阻率在使用环境下也不会改变很多。;解决方案:根据本发明的用于形成Ag合金膜的溅射靶的组成为Sb的0.2原子%以上且2.0原子%以下,Mg的0.05原子%以上且1.00原子%以下,其余为Ag和不可避免的杂质。;版权:(C)2014,日本特许厅

著录项

  • 公开/公告号JP2014159628A

    专利类型

  • 公开/公告日2014-09-04

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20140004584

  • 发明设计人 TOSHIMORI YUTO;NONAKA SOHEI;

    申请日2014-01-14

  • 分类号C23C14/34;G11B7/258;C22C5/06;H01L21/28;H01L21/285;H01L51/50;H05B33/26;G11B7/24062;G11B7/26;

  • 国家 JP

  • 入库时间 2022-08-21 16:18:04

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