TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSING USING THE SAME, WAFER PROCESSED BODY, AND METHOD FOR PRODUCING THIN WAFER

摘要

PROBLEM TO BE SOLVED: To provide a wafer processed body which has an appropriate separation force with a cleaning property after separation retained, a member for wafer processing, a temporary adhesive for wafer processing, and a method for producing a thin wafer using the same.SOLUTION: An embodiment comprises two layers of siloxane including: a first temporary adhesive layer, which is releasably bonded to a surface of a wafer and is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane and an organopolysiloxane resin, where the organopolysiloxane resin contains a RRRSiOunit (R, Rand Reach represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms or a hydroxyl group) and a SiOunit with the molar ratio of the RRRSiOunit to the SiOunit in the range from 0.6 to 1.7; and a second temporary adhesive layer, which is laminated on the first temporary adhesive layer and releasably bonded to the support and is a thermosetting modified siloxane polymer layer (B).