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Temporary adhesive for wafer processing, wafer processing member using the same, wafer processed body, and method for producing thin wafer
Temporary adhesive for wafer processing, wafer processing member using the same, wafer processed body, and method for producing thin wafer
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机译:用于晶片处理的临时粘合剂,使用该粘合剂的晶片处理构件,晶片处理体以及用于生产薄晶片的方法
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摘要
The present invention provided is the temporary adhesive for wafer processing which temporarily bonds a wafer having a circuit face on the front surface and a processing face on the back surface to a support, and includes a first temporary adhesive layer which is a layer (A) of a thermoplastic resin modified organopolysiloxane obtained by partial dehydration condensation of an organopolysiloxane resin containing a R21R22R23SiO1/2, and a SiO4/2 unit in a molar ratio of R21R22R23SiO1/2 unit/SiO4/2 unit of 0.6 to 1.7 and an organopolysiloxane represented by the following general formula (1), and a second temporary adhesive layer which is a thermosetting modified siloxane polymer layer (B) which is laminated on the first temporary adhesive layer and is releasably bonded to the support.
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