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Conductive ball capture device and conductive ball capture manner and conductive ball on-board manner

机译:导电球捕获装置,导电球捕获方式和板上导电球

摘要

P To provide a conductive ball trapping device, a conductive ball trapping method, and a conductive ball mounting method and which enable a ball loading operation to be accurately performed even in the case of a minute conductive ball. PSOLUTION: A conductive ball trapping device 10 includes: a bar electrode 11; a dielectric layer 12 including a contact surface 12A coming into contact with a tip of the bar electrode 11, and a trapping surface 12B ON the other side of the contact surface 12A by which a conductive ball 1 is trapped; and an auxiliary electrode 14 disposed ON the contact surface 12A so as to surround the bar electrode 11. The conductive ball 1 is trapped by using the conductive ball trapping device 10 and mounted in a desired position ON a substrate. PCOPYRIGHT: (C)2012 and JPO& INPIT
机译:

提供一种导电球捕捉装置,导电球捕捉方法和导电球安装方法,并且即使在微小的导电球的情况下,也能够精确地执行球加载操作。解决方案:导电球捕集装置10包括:棒状电极11;介电层12,其具有与条状电极11的前端相接的接触面12A,以及在该接触面12A的另一侧的被捕捉导电球1的捕捉面12B。辅助电极14以包围棒状电极11的方式配置在接触面12A上。导电球1通过使用导电性球捕捉装置10而被捕捉,并被安装在基板上的期望位置。

版权:(C)2012和JPO&INPIT

著录项

  • 公开/公告号JP5373725B2

    专利类型

  • 公开/公告日2013-12-18

    原文格式PDF

  • 申请/专利权人 株式会社和井田製作所;

    申请/专利号JP20100204485

  • 发明设计人 星野 坦之;南光 進;

    申请日2010-09-13

  • 分类号H01L21/60;H05K3/34;

  • 国家 JP

  • 入库时间 2022-08-21 16:11:37

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