Conductive ball on-board device and conductive ball on-board manner

摘要

PROBLEM TO BE SOLVED: To surely perform mounting operation of a conductive ball by setting a pressing force by which such an adhesive substance as flux is applied to the conductive ball to be smaller than that by which the conductive ball is mounted on the work positioned by a positioning part. ;SOLUTION: A pressing force control part controls a cylinder for pressing down a suction tool 32 by a weak pressing force F1, so that the weak pressing force F1 acts on a solder ball 1, so that an excessive force does not act on the lower surface of the adsorption tool 32 and the solder ball 1 when the solder ball 1 is pressed to a flat surface 16a of a vessel 16. Then, the solder ball 1 to which is stuck flux 2 by the suction tool 32 is transported to a substrate 11 side. Then, the pressing force control part controls the cylinder so as to apply a large pressing force F2 on the suction tool 32. Thus, the solder ball 1 is surely pressed to an electrode 12.;COPYRIGHT: (C)1998,JPO