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Time dependent dielectric breakdown (TDDB) test structure of semiconductor device and method of performing TDDB test using the same

机译:半导体器件的时变介电击穿(TDDB)测试结构以及使用该结构的TDDB测试方法

摘要

A time dependent dielectric breakdown (TDDB) test structure of a semiconductor device includes: a first test cell having a first test pattern in which a dielectric layer is formed between two electrodes; a second test cell spaced apart from the first test cell and having a second test pattern in which a dielectric layer is formed between two electrodes; and a barrier region configured to prevent electrical interference from occurring between the first test cell and the second test cell during a TDDB test.
机译:半导体器件的时变介电击穿(TDDB)测试结构包括:具有第一测试图案的第一测试单元,其中在两个电极之间形成介电层;第二测试单元与第一测试单元间隔开并且具有第二测试图案,其中在两个电极之间形成介电层。阻挡区域,其被配置为防止在TDDB测试期间在第一测试单元和第二测试单元之间发生电干扰。

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