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Defective-ratio predicting method, defective-ratio predicting program, managing method for semiconductor manufacturing apparatus, and manufacturing method for semiconductor device

机译:不良率预测方法,不良率预测程序,半导体制造装置的管理方法以及半导体装置的制造方法

摘要

In a managing system for a semiconductor manufacturing apparatus, a predicting unit 121 predicts a characteristic defective ratio and a foreign-substance defective ratio of each process obtains an actual defective ratio of each fail bit mode and a critical area of each process and each fail bit mode, calculates the number of foreign substances of each process by using the actual defective ratio of each fail bit mode and the critical area of each process and each fail bit mode, the fail bit mode being except for an arbitrary fail bit mode, calculates a foreign-substance defective ratio of each process and a foreign-substance defective ratio of each fail bit mode by using the number of foreign substances, and calculates a characteristic defective ratio of the arbitrary fail bit mode based on the foreign-substance defective ratio and actual defective ratio of each fail bit mode.
机译:在半导体制造设备的管理系统中,预测单元 121 预测特征缺陷率,并且每个过程的异物缺陷率获得每个失效位模式和临界区域的实际缺陷率。每个过程和每个故障位模式的总和,通过使用每个故障位模式的实际缺陷率以及每个过程和每个故障位模式的临界面积来计算每个过程的异物的数量,除了任意故障位模式,通过使用异物的数量来计算每个过程的异物不良率和每个故障位模式的异物不良率,并基于该任意失效位模式计算特征故障率每个失效位模式的异物不良率和实际不良率。

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