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Semiconductor defect classifying method, semiconductor defect classifying apparatus, and semiconductor defect classifying program

机译:半导体缺陷分类方法,半导体缺陷分类装置以及半导体缺陷分类程序

摘要

A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.
机译:通过准确地确定设计布局图案和缺陷之间的重叠状态,可以有效地对缺陷进行分类。这导致对系统缺陷的简单识别。通过检查或检查半导体器件而获得的缺陷图像会自动与设计布局数据进行图案匹配。缺陷被叠加在目标层的至少一层,目标层正上方的层和目标层正下方的层的设计布局图案上。将缺陷的重叠状态确定为图案内,图案上方或图案外,然后自动对缺陷进行分类。

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