Provided are a light-emitting diode package and a heat dissipation module used by same. A heat dissipation module (10) comprises: a carrier substrate (11), which is composed of a substrate selected from the group of an aluminum substrate, a magnesium substrate, an aluminum-magnesium alloy substrate and a titanium alloy substrate; an insulation layer (12), which is formed by applying an oxidation method or nitridation method to a surface of the carrier substrate (10) to directly generate the insulation layer (12) composed of a metal material on the surface of the carrier substrate (10) by means of oxidation or nitridation reaction; and a line layer (13), which is formed on the surface of the insulation layer (12), wherein when at least one LED die (20) emits light and generates heat, the heat energy is conducted to the carrier substrate (11) through the insulation layer (12) to dissipate the heat outwards.
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