METHOD FOR MANUFACTURING SOLDER ON PAD ON FINE PITCH PCB SUBSTRATE AND FLIP CHIP BONDING METHOD OF SEMICONDUCTOR USING THE SAME

摘要

The present invention relates to a kind of methods of forming a solder protrusion thin space PCB substrate and a flip chip bonding semiconductor devices, and use is identical, and contains; Extension solder bump (SBM) cream processed of one step has the front of general thickness, includes metal pad and solder mask in PCB substrate; It include the cooling SBM cream of thickener in the SBM for the fusing point that the step of forming solder bump is higher than solder by heating SBM cream and temperature; Solvent is used with remaining solder particle with remaining fluoropolymer resin SBM cream the step of cleaning. ;The 2014 of copyright KIPO submissions