COPPER PLATING SOLUTION AND PRINTED CIRCUIT BOARD INCLUDING COPPER PLATING SOLUTION, AND MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

The present invention provides a copper plating solution, which includes copper oxide powder, a dicarboxylic acid compound, and a compound of the copper oxide powder and the dicarboxylic acid, and includes a printed circuit board that plates a via with the copper plating solution. According to the present invention, the rate of failure such as dimple or void formation on the printed circuit board is reduced and the dicarboxylic acid compound restrains additives from degrading. Thereby, the lifespan of the printed circuit board is extended.;COPYRIGHT KIPO 2014