Increased Peel Strength of Copper Plating Using Supercritical Fluid Methods for Epoxy Printed Circuit Boards

摘要

The metal plating of epoxy polymers has been widely used in industrial products for many years, especially in printed circuit boards (PCBs). It is one of the most important technologies used to manufacture electronic devices due to its high reliability and guaranteed quality. The authors are developing a new concept of PCBs for the next decade is presented, with improved techniques for applying finer lines circuits and higher density conductor layers. An essential objective of this technology is to improve weak copper adhesion peel strength on epoxy insulation materials. The present method for achieving good adhesion of copper plating on different surface is the Pd colloid catalyst method. In order to achieve better adhesion for next generation PCBs, we used the supercritical fluid (SCF) method to impregnate various Pd complexes into epoxy resin, and then decomposed them to produce free metal in the epoxy resin by reduction. An efficient electro-less Cu plating technique was achieved when the metal was deposited into the epoxy resin. This article describes the selection of the metal complexes, impregnation conditions of the complexes, and the peel strength of the plating.