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Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process.

机译：施加电解镀铜电镀。应用于印刷电路板制造过程。

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Hideo HONMA; Tomoyuki FUJINAMI; Hiroaki TAKAGI;
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年度 1990
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1. Air-plasma surface modification of epoxy resin substrate to improve electroless copper plating of printed circuit board [J] . Hong Yan, You Xiangqing, Zeng Yi, Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology . 2019,第期

机译：环氧树脂基材的空气等离子体表面改性改善印刷电路板化学镀铜电镀
2. DEVELOPMENT OF DIFFUSION BARRIER LAYER ON COPPER-PRINTED CIRCUIT BOARD USING ELECTROLESS PLATING METHOD [J] . SITI RABIATULL AISHA IDRIS, ALI OURDJINI, AZMAH HANIM MOHAMAD ARIFF, International Journal of Computational Methods and Experimental Measurements . 2015,第4期

机译：化学镀法在铜基电路板上扩散阻挡层的开发
3. Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards [J] . Teija Laine-Ma, Pekka Ruuskanen, Satu Kortet, Circuit World . 2009,第4期

机译：热塑性PPO基印刷电路板的化学镀铜和表面特性
4. A HIGH SPEED ELECTROLESS COPPER PLATING OF PRINTED CIRCUIT BOARD FROM EDTA·2Na-CONTAINING SOLUTION [C] . XIAO Faxin, SHEN Xiaoni, NIU Fei The Minerals, Metals Materials Society Annual Meeting Exhibition . 2010

机译：来自EDTA·2NA溶液的印刷电路板的高透明电镀铜电镀
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
7. Effect of Ni Content in the Electroless Copper Plating Film on Recrystallization at the Bottom of via in Printed Circuit Board [O] . Hidekazu HONMA, Yuuhei KITAHARA, Joonhaeng KANG 2020

机译：Ni含量在电镀铜镀膜中对印刷电路板底部重结晶的影响

Electroless copper plating by applying electrolysis. Application for a printed circuit board manufacturing process.

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