THIN-FILM TYPE CHIP DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a thin-film type chip device. The thin-film type chip device according to an embodiment of the present invention comprises a coil pattern formed on a substrate; a cavity defining pattern having a cavity which exposes a part of the coil pattern; a filling layer filled in the cavity; and a magnetic layer having a surface layer which covers the surface of the filling layer.;COPYRIGHT KIPO 2014