Solder ball mounting apparatus using gravity, solder ball mounting system and method for mounting solder ball using the same

摘要

solder ball mounting method according to the invention comprises: (A) providing a substrate for mounting to printed circuit solder ball steps to ; (B): a step for mounting between the mounting table and the mask of the solder ball mounting apparatus to the printed circuit board ; (C) supply a number of phase tilts the solder ball to the mask for the mounting , and generation of vibration of the table of the solder ball mounting apparatus according to the control of the control sikimyeo by each acute angle to the table in the left and right direction ; (D) determining that the said control unit , each filled with the solder ball into the opening of the mounting for the mask ; And (E) according to the determination result , the controller generates a vibration to the table as an acute phase tilts again repeatedly each of the table in the horizontal direction ; and a . ;