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SOLDER BALL MOUNTING APPARATUS USING GRAVITY, SOLDER BALL MOUNTING SYSTEM INCLUDING SAME, AND SOLDER BALL MOUNTING METHOD USING SAME
SOLDER BALL MOUNTING APPARATUS USING GRAVITY, SOLDER BALL MOUNTING SYSTEM INCLUDING SAME, AND SOLDER BALL MOUNTING METHOD USING SAME
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机译:使用重力的焊球安装装置,包括相同的焊球安装系统以及使用相同的焊球安装方法
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摘要
A solder ball mounting method according to the present invention includes the following steps of: (A) arranging a printed circuit board in order to mount solder balls; (B) positioning the printed circuit board between a table of a solder ball mounting apparatus and a mask for mounting; (C) supplying multiple solder balls to the mask for mounting, generating a vibration to the table of the solder ball mounting apparatus by the control of a control unit, and respectively tilting the table in a left and right direction at an acute angle; (D) determining whether the control unit fills opening parts of the mask for mounting with the solder balls or not; and (E) generating a vibration to the table and repetitively tilting the table again in the left and right direction respectively at an acute angle by the control unit depending on the determination result.;COPYRIGHT KIPO 2014; [Reference numerals] (400) Control unit; (500) Display unit
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