Solder ball mounting apparatus, solder ball mounting system and method for mounting solder ball using the same

摘要

and the predetermined inclination angle mounted on the top surface of the solder ball mounting apparatus according to the present invention is a printed circuit board transform table , having an opening corresponding to each of the pads of the printed circuit board , and a mask mounted on the table for nested mounting on the printed circuit board , and attached to the top of the table at the respective side end portions of the mounting mesh mask and , a plurality of solder balls on the suction side end portion of the mounting for the mask to include the solder ball to the other end of the circulator for discharging the mounting mask . ;