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APPARATUS, METHOD, AND COMPOSITION FOR FAR EDGE WAFER CLEANING
APPARATUS, METHOD, AND COMPOSITION FOR FAR EDGE WAFER CLEANING
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机译:远缘晶片清洁的装置,方法和组成
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摘要
A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13.
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