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antifuse with the use of non-planar topology

机译:使用非平面拓扑的反熔丝

摘要

Herein, techniques for providing non-volatile antifuse-memory elements and other antifuse connectors discloses. In some embodiments, the antifuse-memory elements with non-planar topology, such as, for example, configured finfet topology. In some such embodiments, the manipulated and fin-topology be used in order to effectively transistors with a lower breakdown voltage, when points with improved emission is to be generated, for use in non-volatile antifuse-memory elements with lower voltage, are suitable. In an exemplary embodiment, a semiconductor anti-fuse device is provided, which is a non-planar diffusion region, with a fin with a tapering section is configured, a dielectric insulation layer on the fin, which contains the tapering section, and a gate material on the dielectric insulation layer contains. The conical portion of the fin can be, for example, by oxidation, etching and / or ablation and can be provided in some cases, it contains a base region, and a dilute region and the dilute region is at least 50% thinner than the base region.
机译:在此,公开了用于提供非易失性反熔丝存储器元件和其他反熔丝连接器的技术。在一些实施例中,反熔丝存储器元件具有非平面拓扑,例如配置的finfet拓扑。在一些这样的实施例中,为了在产生具有改善的发射的点时有效地使用具有较低击穿电压的晶体管和受控的鳍形拓扑结构,适用于具有较低电压的非易失性反熔丝存储器元件中。 。在一个示例性实施例中,提供了一种半导体反熔丝器件,该器件是非平面扩散区域,具有被构造为具有锥形部分的鳍片,位于鳍片上的介电绝缘层,该绝缘层包含锥形部分,以及栅极。介电绝缘层上的材料包含。鳍的圆锥形部分可以例如通过氧化,蚀刻和/或烧蚀来提供,并且在某些情况下可以提供,它包含基极区和稀薄区,并且稀薄区比薄层至少薄50%。基本区域。

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