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TDDB and Pulse-Breakdown Studies of Si-Rich Antifuses and Antifuse-Based ROMs

机译:富硅反熔丝和基于反熔丝的ROM的TDDB和脉冲击穿研究

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摘要

Antifuses are electronic devices that can be irreversibly converted from a high-resistance state to a low-resistance state. Thus, they are ideal candidates for one-time-programmable many-times-readable nonvolatile memories. In this paper, the reliability and the programming characteristics of Si-rich $hbox{SiN}_{x}$ antifuses have been studied using time-dependent dielectric breakdown and pulse-breakdown measurements on both single-device test structures and full read-only memories. Contrary to measurements on thick films in which the Poole–Frenkel barrier lowering dominates breakdown, these measurements on fully processed and integrated antifuses indicate that a Fowler–Nordheim-like mechanism governs both programming and long-term reliability.
机译:反熔丝是可以从高电阻状态不可逆地转换为低电阻状态的电子设备。因此,它们是一次性可编程多次可读非易失性存储器的理想候选者。在本文中,使用时变介质击穿和脉冲击穿测量对单器件测试结构和全读取器件进行了研究,研究了富Si的$ hbox {SiN} _ {x} $反熔丝的可靠性和编程特性。只有回忆。与在Poole-Frenkel势垒降低占主导地位的厚膜上进行测量相反,对完全加工和集成的反熔丝进行的测量表明,类似于Fowler-Nordheim的机制可控制编程和长期可靠性。

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