Chemico-mechanical polishing pad with broad-spectrum end-point detection window and method of polishing with it

摘要

There is provided a chemical mechanical polishing pad comprising: a polishing layer having a polishing surface and a broad spectrum endpoint acquisition window block having a thickness along an axis perpendicular to a plane of the polishing surface, the wide spectrum endpoint acquisition window block comprising a cyclic olefin addition polymer, wherein the The broad spectrum endpoint acquisition window block has a uniform chemical composition across its thickness, the wide spectrum endpoint acquisition window block having a spectrum loss of ≤ 40%, and the polishing surface being adapted to polish a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate ,