Au-Sn-Ag SERIES SOLDER ALLOY, ELECTRONIC COMPONENT SEALED USING THE Au-Sn-Ag SERIES SOLDER ALLOY AND ELECTRONIC COMPONENT-EQUIPPED DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an Au-Sn-Ag series lead-free solder alloy for high temperature that is fully usable even for bonding electronic component or an electronic component-equipped device such as a quartz device, an SAW filter and an MEMS which requires extremely high reliability; and moreover, is particularly low-cost, is excellent in workability and stress-relaxation ability and is also excellent in reliability.;SOLUTION: The Au-Sn-Ag series solder alloy is provided which contains 27.5 mass% or more and less than 33.0 mass% of Sn, 8.0-14.5 mass% of Ag and the remainder being composed of Au and, more preferably, contains 29.0-32.0 mass% of Sn, 10.0-14.0 mass% of Ag and the remainder being composed of Au except elements inevitably contained during production.;COPYRIGHT: (C)2015,JPO&INPIT