Provided is a lead-free, high-temperature-use Au-Sn-Ag series solder alloy that is fully usable for bonding an electronic component or an electronic component-equipped device which requires extremely high reliability, such as a liquid crystal device, a SAW filter or a MEMS; moreover, the Au-Sn-Ag series solder alloy is particularly low-cost, and has excellent workability and stress-relaxation ability, with excellent reliability. The Au-Sn-Ag series solder alloy is characterized by containing between 27.5% by mass inclusive to 33.0% by mass exclusive of Sn, between 8.0% by mass and 14.5% by mass inclusive of Ag, the remainder being constituted from Au, and more preferably, by containing between 29.0% by mass and 32.0% by mass inclusive of Sn and containing between 10.0% by mass and 14.0% by mass inclusive of Ag, and the remainder comprising Au while excluding elements that are unavoidably included during production.
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